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By Yong Liu

Power digital Packaging presents an in-depth review of energy digital packaging layout, assembly,reliability and modeling. due to the fact that there's a drastic distinction among IC fabrication and tool digital packaging, the publication systematically introduces common strength digital packaging layout, meeting, reliability and failure research and fabric choice so readers can truly comprehend every one task's certain features. energy digital packaging is without doubt one of the quickest starting to be segments within the energy digital undefined, as a result of speedy development of strength built-in circuit (IC) fabrication, specifically for functions like moveable, customer, domestic, computing and automobile electronics. This publication also covers how advances in either semiconductor content material and gear complex package deal layout have helped reason advances in strength equipment potential lately. the writer extrapolates the most recent trends within the book's components of concentration to focus on the place additional development in fabrics and strategies can force persisted developments, quite in thermal administration, usability, potency, reliability and total fee of strength semiconductor solutions.

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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling by Yong Liu


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